
Conte aos seus amigos sobre este item:
ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
ASM International
ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
ASM International
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
461 pages
Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
Lançado | 30 de julho de 2022 |
ISBN13 | 9781627084192 |
Editoras | A S M International |
Páginas | 461 |
Dimensões | 286 × 231 × 31 mm · 1,15 kg |
Ver tudo de ASM International ( por exemplo Hardcover Book , Paperback Book e PC )