Conte aos seus amigos sobre este item:
SemiConductor Wafer Bonding: Science and Technology - The ECS Series of Texts and Monographs
Tong, Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China)
Preço
Mex$ 3.587
excluindo impostos
Item sob encomenda (no estoque do fornecedor)
Espera-se estar pronto para envio 30 de out - 6 de nov
O que dizem nossos clientes:
Adicione à sua lista de desejos do iMusic
SemiConductor Wafer Bonding: Science and Technology - The ECS Series of Texts and Monographs
Tong, Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China)
Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.
320 pages, illustrations
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 7 de dezembro de 1998 |
| ISBN13 | 9780471574811 |
| Editoras | John Wiley & Sons Inc |
| Páginas | 320 |
| Dimensões | 164 × 246 × 20 mm · 566 g |
| Idioma | English |