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Integrated Circuit Packaging, Assembly and Interconnections William Greig Softcover reprint of hardcover 1st ed. 2007 edition
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Integrated Circuit Packaging, Assembly and Interconnections
William Greig
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.
300 pages, 75 black & white illustrations, biography
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 29 de outubro de 2010 |
| ISBN13 | 9781441939234 |
| Editoras | Springer-Verlag New York Inc. |
| Páginas | 300 |
| Dimensões | 155 × 235 × 17 mm · 458 g |
| Idioma | Inglês |
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