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Area Array Interconnection Handbook Softcover reprint of the original 1st ed. 2001 edition
Area Array Interconnection Handbook
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer.
1900 pages, biography
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 12 de novembro de 2012 |
| ISBN13 | 9781461355298 |
| Editoras | Springer-Verlag New York Inc. |
| Páginas | 1188 |
| Dimensões | 178 × 254 × 36 mm · 2,46 kg |
| Idioma | Inglês |
| Editor | Puttlitz, Karl J. |
| Editor | Totta, Paul A. |