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SiC Power Module Design: Performance, robustness and reliability - Energy Engineering
Alberto Castellazzi
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SiC Power Module Design: Performance, robustness and reliability - Energy Engineering
Alberto Castellazzi
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
360 pages
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 3 de fevereiro de 2022 |
| ISBN13 | 9781785619076 |
| Editoras | Institution of Engineering and Technolog |
| Páginas | 360 |
| Dimensões | 241 × 163 × 28 mm · 708 g |
| Idioma | English |
| Editor | Castellazzi, Alberto (Professor, Kyoto University of Advanced Science, Japan) |
| Editor | Irace, Andrea (Professor of Electronics, University of Naples Federico II, Italy) |
Ver tudo de Alberto Castellazzi ( por exemplo Hardcover Book )