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Die Attach Materials for High Temperature Applications in Microelectronics Packa 1st ed. 2019 edition
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Die Attach Materials for High Temperature Applications in Microelectronics Packa
276 pages, 100 Tables, color; 121 Illustrations, color; 54 Illustrations, black and white; XX, 276 p
| Mídia | Livros Book |
| Lançado | 7 de fevereiro de 2019 |
| ISBN13 | 9783319992556 |
| Editoras | Springer International Publishing AG |
| Páginas | 279 |
| Dimensões | 242 × 167 × 19 mm · 623 g |
| Idioma | Alemão |
| Editor | Siow, Kim S. |
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