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Diamond Integration for Electronics Cooling - Wspc Series in Advanced Integration and Packaging Graham Samuel
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Diamond Integration for Electronics Cooling - Wspc Series in Advanced Integration and Packaging
Graham Samuel
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| A ser lançado | 27 de dezembro de 2026 |
| ISBN13 | 9789819834006 |
| Editoras | World Scientific Publishing Co Pte Ltd |
| Páginas | 244 |
| Dimensões | 150 × 220 × 20 mm · 574 g (Peso (estimado)) |
| Editor | Graham, Samuel (University of Maryland, USA) |
| Editor | Kuball, Martin (University of Bristol, USA) |
![Cover for Lincoln, Don (Fermi National Accelerator Laboratory, USA) · Understanding the Universe: from Quarks to the Cosmos (Paperback Book) [Third Edition] (2027)](https://imusic.b-cdn.net/images/item/original/690/9789819835690.jpg?lincoln-don-fermi-national-accelerator-laboratory-usa-2027-understanding-the-universe-from-quarks-to-the-cosmos-paperback-book&class=scaled&v=1788194154)
![Cover for Lincoln, Don (Fermi National Accelerator Laboratory, USA) · Understanding the Universe: from Quarks to the Cosmos (Hardcover Book) [Third Edition] (2027)](https://imusic.b-cdn.net/images/item/original/457/9789819834457.jpg?lincoln-don-fermi-national-accelerator-laboratory-usa-2027-understanding-the-universe-from-quarks-to-the-cosmos-hardcover-book&class=scaled&v=1789410310)
