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Manufacturing Challenges in Electronic Packaging Y C Lee Softcover reprint of the original 1st ed. 1998 edition
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Manufacturing Challenges in Electronic Packaging
Y C Lee
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
261 pages, biography
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 25 de setembro de 2012 |
| ISBN13 | 9781461376590 |
| Editoras | Springer-Verlag New York Inc. |
| Páginas | 261 |
| Dimensões | 155 × 235 × 14 mm · 390 g |
| Idioma | Inglês |
| Editor | Chen, W.T. |
| Editor | Lee, Y.C. |
![Cover for Y C Lee · Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging (Hardcover Book) [2007 edition] (2006)](https://imusic.b-cdn.net/images/item/original/749/9780387279749.jpg?y-c-lee-2006-micro-and-opto-electronic-materials-and-structures-physics-mechanics-design-reliability-packaging-volume-i-materials-physics-materials-mechanics-volume-ii-physical-design-reliability-and-packaging-hardcover-book&class=scaled&v=1669944797)