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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation
Lei He
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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation
Lei He
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
94 pages
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 30 de junho de 2011 |
| ISBN13 | 9781601984586 |
| Editoras | now publishers Inc |
| Páginas | 94 |
| Dimensões | 156 × 234 × 5 mm · 145 g |
| Idioma | English |
