Conte aos seus amigos sobre este item:
Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Softcover reprint of hardcover 1st ed. 2005 edition
Ehrenfried Zschech
Preço
zł 770,90
excluindo impostos
Item sob encomenda (no estoque do fornecedor)
Espera-se estar pronto para envio 29 de set - 3 de out
O que dizem nossos clientes:
Adicione à sua lista de desejos do iMusic
Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Softcover reprint of hardcover 1st ed. 2005 edition
Ehrenfried Zschech
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
508 pages, 72 black & white tables, biography
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 22 de outubro de 2010 |
| ISBN13 | 9781849969673 |
| Editoras | Springer London Ltd |
| Páginas | 508 |
| Dimensões | 155 × 235 × 27 mm · 734 g |
| Idioma | English |
| Editor | Mikolajick, Thomas |
| Editor | Whelan, Caroline |
| Editor | Zschech, Ehrenfried |
Mostrar tudo
Mais por Ehrenfried Zschech
Ver tudo de Ehrenfried Zschech ( por exemplo Hardcover Book e Paperback Book )