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High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering Chulwoo Kim 2014 edition
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High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering
Chulwoo Kim
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
112 pages, 50 black & white illustrations, 41 colour illustrations, 8 black & white tables, 1 colour
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 18 de novembro de 2013 |
| ISBN13 | 9783319023809 |
| Editoras | Springer International Publishing AG |
| Páginas | 112 |
| Dimensões | 155 × 235 × 5 mm · 149 g |
| Idioma | Inglês |
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