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Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation 2023 edition
Yongle Wu
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation 2023 edition
Yongle Wu
This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases.
311 pages, 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illu
Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
Lançado | 2 de junho de 2023 |
ISBN13 | 9789819914548 |
Editoras | Springer Verlag, Singapore |
Páginas | 311 |
Dimensões | 635 g |
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