New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies - Nabil Shovon Ashraf - Livros - Springer International Publishing AG - 9783031008993 - 16 de fevereiro de 2016
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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies

Nabil Shovon Ashraf

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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

Mídia Livros     Paperback Book   (Livro de capa flexível e brochura)
Lançado 16 de fevereiro de 2016
ISBN13 9783031008993
Editoras Springer International Publishing AG
Páginas 72
Dimensões 176 g
Idioma English  

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